Tensile Strength of Joints Bonded With a Nano-particle-Reinforced Adhesive
Authors: Park, Sang Wook; Kim, Byung Chul; Lee, Dai Gil
Source: Journal of Adhesion Science and Technology, Volume 23, Number 1, 2009 , pp. 95-113(19)
Publisher: VSP, an imprint of Brill
Abstract:
In order to improve the tensile lap shear strength of adhesively bonded joints, nano-particles were dispersed in the adhesive using a 3-roll mill. The dispersion states of nano-particles in the epoxy adhesive were observed with TEM (Transmission Electron Microscopy) with respect to the mixing conditions, and the effect of nano-particles on the mechanical properties of the adhesive was measured with respect to dispersion state and weight content of nano-particles. Also the static tensile load capability of the adhesively bonded double lap joints composed of uni-directional glass/epoxy composite and nano-particle-reinforced epoxy adhesive was investigated to assess the effect of nano-particles on the lap shear strength of the joint.From the experimental and FE analysis results, it was found that the nano-particles in the adhesive improved the mechanical properties of the adhesive. Also the increased failure strain and the reduced CTE (coefficient of thermal expansion) of the nano-particle-reinforced adhesive improved the lap shear strength of adhesively bonded joints.Keywords: DOUBLE LAP JOINT; CARBON BLACK; NANO-PARTICLES; PARTICLE-REINFORCED ADHESIVE
Document Type: Research article
DOI: http://dx.doi.org/10.1163/156856108X344063
Affiliations: 1: Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, ME3221, Guseong-dong, Yuseong-gu, Daejeon 305-701, Republic of Korea
Publication date: 2009-01-01
- In this: publication
- By this: publisher
- In this Subject: Chemistry (General) , Engineering/Technology , Materials & Manufacturing
- By this author: Park, Sang Wook ; Kim, Byung Chul ; Lee, Dai Gil

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