Recent Advances in Nano-conductive Adhesives

Authors: Daniel Lu, Daoqiang1; Grace Li, Yi2; Wong, C.P.2

Source: Journal of Adhesion Science and Technology, Volume 22, Numbers 8-9, 2008 , pp. 815-834(20)

Publisher: VSP, an imprint of Brill

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Abstract:

Nano-conductive adhesives have been attracting more and more interest in microelectronic packaging field due to their unique electrical and mechanical properties compared to conventional conductive adhesives. There has been extensive research on nano-conductive adhesives which contain nano-fillers such as nano-particles, nano-wires or carbon nano-tubes. This paper provides a comprehensive review of most recent advances in nano-conductive adhesives.

Keywords: ISOTROPIC CONDUCTIVE ADHESIVES; ANISOTROPIC CONDUCTIVE ADHESIVES; NANO-WIRES; NANO-PARTICLES; CARBON NANO-TUBES; CONDUCTIVITY; SELF-ASSEMBLED MONOLAYERS; SILVER MIGRATION; FINE PITCH FLIP CHIP INTERCONNECTION

Document Type: Research article

DOI: 10.1163/156856108X305471

Affiliations: 1: Intel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226, USA;, Email: daniellu66@gmail.com 2: School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA

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