Static and Dynamic Wetting Characteristics of Nano-patterned Surfaces

Authors: Harder, Paul M.¹; Shedd, Timothy A.²; Colburn, Matthew³

Source: Journal of Adhesion Science and Technology, Volume 22, Number 15, 2008 , pp. 1931-1948(18)

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Abstract:

In efforts to increase the scanning speeds of the current state-of-the-art IC chip manufacturing process, immersion lithography, the present work investigates the liquid wetting effects of oriented surface nanopatterns with varying depth. In this set of experiments, both static and forced dynamic contact line behaviors of two liquids were studied on two substrate materials imprinted with line-space nanopatterns of varying depth and hybridization (second tier of nano-posts). These experiments found a variety hydrophobic and hydrophilic behaviors, some of which deviate from conventional wetting theories. Specifically, the static and dynamic liquid contact angles are found to consistently depend on the depth of patterns with the same interfacial areas, and a surface with contact angle less than 90° was turned highly hydrophobic with the addition of patterns.

Keywords: DYNAMIC CONTACT ANGLE; WETTING; NANO-PATTERNED SURFACES; PHOTORESIST

Document Type: Research article

DOI: http://dx.doi.org/10.1163/156856108X320078

Affiliations: 1: Multiphase Flow Visualization and Analysis Laboratory, Department of Mechanical Engineering, University of Wisconsin-Madison, 1500 Engineering Drive, Madison, WI 53706-1609, USA 2: Multiphase Flow Visualization and Analysis Laboratory, Department of Mechanical Engineering, University of Wisconsin-Madison, 1500 Engineering Drive, Madison, WI 53706-1609, USA;, Email: shedd@engr.wisc.edu 3: IBM Research — Advanced Lithography, 255 Fuller Road, Albany, NY 12203, USA

Publication date: 2008-10-01