Authors: Zenner, Robert L.D.¹; Murray, Cameron T.²; Fisher, Carl³

Source: Journal of Adhesion Science and Technology, Volume 22, Number 14, 2008 , pp. 1781-1797(17)

Publisher: VSP, an imprint of Brill

Abstract:

An accurate assessment of the bonding temperature values in the adhesive layer during Anisotropic Conductive Film bonding is complicated by several factors related to small dimensions, large temperature gradients, and inherent-thermal perturbations caused by the measurement technique. Thermal modeling simulations were used to characterize the temperature values and evaluate their influences on the dynamic temperature variation through the bonding process used for thin electronic devices. These simulations reveal the degree of temperature gradient through the electronic assembly layers and within the adhesive, the effects of design changes, and the significance of equipment parameters on the temperatures reached during bonding. The simulations show that the adhesive temperature can vary by more than 30°C across the characteristic sizes both of the total bond area and along or between the individual circuit traces. Also, the heat transfer through the layers showed changes due to the device design and bonding equipment base material choice of 40 to 80°C in some cases. Therefore, thermocouples in the adhesive used to measure the temperature must use very fine wire size and require meticulous precision in positioning to insure accuracy and reproducibility in the adhesive bonding conditions to enable the highest yield and reliability.

Keywords: ANISOTROPIC CONDUCTIVE FILM ADHESIVE; TEMPERATURE; THERMAL MODEL THERMOCOUPLE; BONDING; THIN ELECTRONIC ASSEMBLY

Document Type: Research article

DOI: http://dx.doi.org/10.1163/156856108X320582

Affiliations: 1: Electronics Markets Materials Division, 3M Company, 3M Center, Maplewood, MN 55144, USA 2: Electronics Markets Materials Division, 3M Company, 3M Center, Maplewood, MN 55144, USA;, Email: ctmurray1@mmm.com 3: Corporate Research Materials Laboratory, 3M Company, 3M Austin Center, 6801 River Place Boulevard, Austin, TX 78726, USA

Publication date: 2008-09-01

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• In this Subject: Chemistry (General) ,  Engineering/Technology ,  Materials & Manufacturing
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