Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
Authors: Li, Jing1; Lumpp, Janet K.2; Andrews, Rodney3; Jacques, David3
Source: Journal of Adhesion Science and Technology, Volume 22, Number 14, 2008 , pp. 1659-1671(13)
Publisher: VSP, an imprint of Brill
Abstract:
Isotropic conductive adhesives (ICAs) filled with metal particles are commercially available as alternatives to solder joining in electronic packaging. Replacing metal fillers with multiwall carbon nanotubes (MWCNTs) offers the potential benefits of being corrosion resistant, high strength and lightweight. Traditional metal filled ICAs require high metal loading to ensure electrical conductivity, which may cause problems with respect to reliability and strength to weight ratio. The ultra-high aspect ratio and surface area of multiwall carbon nanotubes induce a low percolation threshold of less than 0.25 wt% in epoxy. MWCNTs dispersed in epoxy increase the thermal diffusivity of the polymer by a factor of 2 to 3 and decrease the volume resitivity to less than 10 Ω cm for loadings up to 12 wt%. Lap shear strength decreases with increased MWCNT loading. The dependences of electrical, thermal and mechanical properties on loading and aspect ratio of MWCNTs are reported, and the electrical conduction mechanism is discussed.Keywords: ISOTROPIC CONDUCTIVE ADHESIVE; MULTIWALL CARBON NANOTUBES; MWCNTS; PERCOLATION THRESHOLD; EPOXY
Document Type: Research article
DOI: http://dx.doi.org/10.1163/156856108X320528
Affiliations: 1: Electrical and Computer Engineering Department, 453 F. Paul Anderson Tower, Lexington, KY 40506-0046, USA 2: Electrical and Computer Engineering Department, 453 F. Paul Anderson Tower, Lexington, KY 40506-0046, USA;, Email: jklumpp@uky.edu 3: Center for Applied Energy Research, University of Kentucky, Lexington, KY 40506, USA
Publication date: 2008-09-01
- In this: publication
- By this: publisher
- In this Subject: Chemistry (General) , Engineering/Technology , Materials & Manufacturing
- By this author: Li, Jing ; Lumpp, Janet K. ; Andrews, Rodney ; Jacques, David

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