Journal of Adhesion Science and Technology

Editorial Note
pp. 1333-1333(1)
Author: Mittal, Kash

Guest Editorial
pp. 1335-1337(3)
Authors: da Silva, Lucas F.M.; Öchsner, Andreas

Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films
pp. 1339-1354(16)
Authors: Kim, Jong-Woong; Lee, Young-Chul; Ko, Jae-Hoon; Nah, Wansoo; Jeong, Myung Yung; Kwon, Hyuk-Chon; Jung, Seung-Boo

Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste
pp. 1355-1364(10)
Authors: Noh, Bo-In; Lee, Jong-Bum; Kim, Jong-Woong; Jung, Seung-Boo

A New Finite Element Formulation for Thin Non-Homogeneous Heat-Conducting Adhesive Layers
pp. 1365-1378(14)
Authors: Öchsner, Andreas; Mishuris, Gennady

Measurement of Adhesion Force by a Symmetric AFM Probe for Nano-imprint Lithography Application
pp. 1379-1386(8)
Authors: Lee, Hee-Jung; Hyun, Seungmin; Kim, Jae-Hyun; Lee, Hak-Joo; Choi, Dae-Geun; Lee, Dong-II; Jeong, Jun-Ho; Lee, Eung-Sug

Molecular Dynamics Simulation of Polymer-Metal Bonds
pp. 1387-1400(14)
Authors: Suérez, J.C.; Miguel, S.; Pinilla, P.; López, F.

Curing Behavior and Adhesion Performance of UV-Curable Styrene-Isoprene-Styrene-Based Pressure-Sensitive Adhesives
pp. 1401-1423(23)
Authors: Park, Young-Jun; Lim, Dong-Hyuk; Kim, Hyun-Joong; Joo, Hyo-Sook; Do, Hyun-Sung

Surface Modification of Low Density Polyethylene (LDPE) Film Using Corona Discharge Plasma for Technological Applications
pp. 1425-1442(18)
Authors: Pascual, M.; Sanchis, R.; Sánchez, L.; García, D.; Balart, R.

The Effect of Surface Modification of Silica Microfillers in an Epoxy Matrix on the Thermo-mechanical Properties
pp. 1443-1459(17)
Authors: Olmos, D.; Baselga, J.; Mondragon, I.; González-Benito, J.

Influence of Silanisation Parameters With γ-Methacryloxypropyltrimethoxysilane on Durability of Aluminium/Acrylic Adhesive Joints
pp. 1461-1475(15)
Authors: Del Real, J.C.; Cano de Santayana, M.; Abenojar, J.; Pantoja, M.; Martinez, M.A.

Parametric Study of Adhesively Bonded Single Lap Joints by the Taguchi Method
pp. 1477-1494(18)
Authors: da Silva, Lucas F.M.; Critchlow, G.W.; Figueiredo, M.A.V.

Peel Behaviour of Aircraft Fuel Tank Sealants: the Effect of Peel Angle, Sealant Layer Thickness and Peel Rate
pp. 1495-1522(28)
Authors: Giannis, S.; Adams, R.D.; Clark, L.J.; TAYLOR, M.A.

Identification of the Strain Rate Parameters for Structural Adhesives
pp. 1523-1540(18)
Authors: Fancello, E.; Goglio, L.; Stainier, L.; Vassoler, J.M.

On Modelling the Non-linear Behaviour of Thin Adhesive Films in Bonded Assemblies With Interface Elements
pp. 1541-1563(23)
Authors: Créac'hcadec, R.; Cognard, J.Y.; Heuzé, T.h.

Computational Modelling of the Residual Strength of Repaired Composite Laminates Using a Cohesive Damage Model
pp. 1565-1591(27)
Authors: Campilho, R.D.S.G.; de Moura, M.F.S.F.; Domingues, J.J.M.S.; Morais, J.J.L.