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Ecologically clean solder based on Sn–Ag–Cu

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A solder is developed, which does not contain harmful components such as lead and shows super performance properties, at the same time the processing behaviour of the solder remains unchanged.
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Keywords: environmental safety; mechanical strength; solder

Document Type: Research Article

Affiliations: Tol'yatti State University, Tol'yatti, Russia

Publication date: 2011-07-01

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