Ecologically clean solder based on Sn–Ag–Cu

$61.74 plus tax (Refund Policy)

Buy Article:

Abstract:

A solder is developed, which does not contain harmful components such as lead and shows super performance properties, at the same time the processing behaviour of the solder remains unchanged.

Keywords: environmental safety; mechanical strength; solder

Document Type: Research Article

DOI: http://dx.doi.org/10.1080/09507116.2011.554256

Affiliations: Tol'yatti State University, Tol'yatti, Russia

Publication date: July 1, 2011

Related content

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more