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Ecologically clean solder based on Sn–Ag–Cu

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Abstract:

A solder is developed, which does not contain harmful components such as lead and shows super performance properties, at the same time the processing behaviour of the solder remains unchanged.

Keywords: environmental safety; mechanical strength; solder

Document Type: Research Article

DOI: http://dx.doi.org/10.1080/09507116.2011.554256

Affiliations: Tol'yatti State University, Tol'yatti, Russia

Publication date: July 1, 2011

tandf/weld/2011/00000025/00000007/art00010
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