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Solderability of metallic glass

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Keywords: intermetallic compounds; lead-free solder; low-temperature welding; metallic glass; oxides; soldering; wettability

Document Type: Research Article

DOI: http://dx.doi.org/10.1080/09507111003655390

Affiliations: JWRI, Osaka University, Osaka, Japan

Publication date: July 1, 2011

tandf/weld/2011/00000025/00000007/art00004
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