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Publisher: Taylor and Francis Ltd

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Volume 31, Number 10, October 2008

Thermo-Hygro-Mechanical Design and Reliability Analysis for CMOS Image Sensor
pp. 917-934(18)
Authors: Hsu, Hsiang-Chen; Lee, Hui-Yu; Hsu, Yu-Cha; Fu, Shen-Li

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Transient Piezothermoelastic Analysis for a Functionally Graded Thermopiezoelectric Hollow Cylinder
pp. 935-955(21)
Authors: Ootao, Yoshihiro; Akai, Tomikazu; Tanigawa, Yoshinobu

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Analysis for Thermal Conductance Effect on the Interfacial Thermal Stresses of Anisotropic Composites
pp. 991-1005(15)
Authors: Shiah, Y. C.; Lin, Yung-Sen; Chen, Y. H.

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Pull-In Instabilities in Functionally Graded Microthermoelectromechanical Systems
pp. 1006-1021(16)
Authors: Hasanyan, D. J.; Batra, R. C.; Harutyunyan, S.

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Publications on Thermal Stresses
pp. 1022-1023(2)
Author: Zhou, Xiangmin

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