Modeling of Substrate Remelting, Flow, and Resolidification in Microcasting

Authors: Hong, F. J.¹; Qiu, H.-H.¹

Source: Numerical Heat Transfer Part A: Applications, Volume 48, Number 10, Number 10/December 15 2005 , pp. 987-1008(22)

Publisher: Taylor and Francis Ltd

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Abstract:

A millimeter-sized molten droplet impacting on a substrate of the same material was modeled. Numerical simulations of microcasting experiments were conducted with the different thermal contact resistances. It was found that the thermal contact resistance affects not only the droplet spreading but also the substrate remelting volume and remelting front configurations. Under the assumption of an appropriate thermal contact resistance, the numerical results of spreading factors, bump heights, and substrate remelting volumes agree well with the experimental data. The effects of droplet impacting velocity, superheat, and substrate temperature were also investigated in detail and some nonintuitional phenomena were discovered.

Document Type: Research article

DOI: 10.1080/10407780500226647

Affiliations: 1: Department of Mechanical Engineering, Hong Kong University of Science and Technology, Kowloon, Hong Kong, China

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