MATERIALS RESEARCH AND THERMOPHYSICS IN EXTREME CASES, SYMPOSIUM Z IN THE FIFTH INTERNATIONAL UNION OF MATERIALS RESEARCH SOCIETIES' (IUMRS) INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS (ICAM '99), AND THE 117TH XIANGSHAN SCIENCE CONFERENCE
Authors: Guo Z. Y.; Liang X. G.
Source: Microscale Thermophysical Engineering, Volume 3, Number 4, 1 October 1999 , pp. 283-291(9)
Publisher: Taylor and Francis Ltd
Abstract:
The goal of these two conferences was to provide cross-discipline forums for materials science and thermophysics researchers to discuss the latest developments of mutual interest in materials science related to thermophysics. The Fifth IUMRS, which was held on 13-18 June, was co-sponsored by the Ministry of Science and Technology of China, the National Natural Science Foundation of China, the China Association for Science and Technology, the Chinese Academy of Science, and the Chinese Academy of Engineering. Symposium Z, held 16-18 June, was organized by Prof. Chang-Lin Tien from the University of California at Berkeley, Prof. Zeng-Yuan Guo from Tsinghua University in Beijing, and Prof. Gang Chen from the University of California at Los Angeles. There were 31 presentations (see Appendix A), which covered topics of thermal properties and heat transport in nanostructures, nonequilibrium phase change in rapid solidification, non-Fourier conduction phenomena, and measurement of thermal properties in extreme cases. The Xiangshan Conference was sponsored by the Ministry of Science and Technology of China and the National Natural Science Foundation of China. Following the IUMRS Conference, the Xiangshan Conference was held for three days at the Fragrant Hill Hotel, which is located in the Beautiful Fragrant Park in the northwest of Beijing. The conference featured overviews of recent results, future prospects, and open discussions and was organized by Xiangshan Science Conference and Tsinghua University. Four overview talks and 15 special talks were scheduled (see Appendix B). The discussions focused on the frontiers of engineering thermophysics and recent development of microscale thermophysical engineering. More than 40 participants from China, Japan, and the United States attended the two conferences. (Brief highlights of the conferences are provided here.)Language: English
Document Type: Research article
Publication date: 1999-10-01
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