Evaluation of Single Phase Flow in Microchannels for High Heat Flux Chip Cooling—Thermohydraulic Performance Enhancement and Fabrication Technology
Authors: SATISH KANDLIKAR1; WILLIAM GRANDE2
Source: Heat Transfer Engineering, Volume 25, Number 8, December 2004 , pp. 5-16(12)
Publisher: Taylor and Francis Ltd
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Abstract:
The increased circuit density on today's computer chips is reaching the heat dissipation limits for air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling with internal flow channels in terms of technological options and challenges. The possibilities presented herein indicate a four- to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel or grooves in the channel surfaces may lead to significant enhancements in single-phase cooling. A simplified and well-established fabrication process is described to fabricate both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process in fabricating complex microstructures within a microchannel.Document Type: Research article
DOI: 10.1080/01457630490519772
Affiliations: 1: Department of Mechanical Engineering, Rochester Institute of Technology, Rochester, New York 2: Department of Microelectronic Engineering, Rochester Institute of Technology, Rochester, New York
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