COMBINED EFFECTS OF SUBCOOLING AND SURFACE ORIENTATION ON POOL BOILING OF HFE-7100 FROM A SIMULATED ELECTRONIC CHIP
Author: El-Genk M.
Source: Experimental Heat Transfer, Volume 16, Number 4, October/November/December 2003 , pp. 281-301(21)
Publisher: Taylor and Francis Ltd
Abstract:
The effects of orientation and subcooling on pool boiling of the HFE-7100 dielectric liquid near atmospheric pressure (0.085 MPa) from a 10 × 10 mm smooth copper surface are investigated experimentally. Results are obtained for inclination angles
= 0° (upward-facing), 30°, 60°, 90°, 120°, 150°, and 180° (downward-facing) and liquid subcoolings
Tsub = 0, 10, 20, and 30 K. Increasing
decreases the saturation nucleate boiling heat flux at high surface superheats (
Tsat > 20 K), but increases it only slightly at lower surface superheats. The critical heat flux (CHF) decreases slowly with increasing
from 0° to 90°, and then deceases faster with increasing
to 180°. CHF increases linearly with increased subcooling, but the rate increases from 0.016 K-1 at 0° to 0.048 K-1 at 180°. At
= 0° and
Tsub = 30 K, CHF is
36 W/cm2 and 24.45 W/cm2 for saturation boiling, while at
= 180° CHF = 10.85 W/cm2 at
Tsub = 30 K and only 4.30 W/cm2 at saturation. The developed correlation for CHF of HFE-7100, as a function of
and
Tsub, is within ±10% of the present data. The recorded still photographs of the boiling surface in the experiments illustrate the effects of liquid subcooling and surface orientation at different nucleate boiling heat fluxes and surface superheats on vapor bubble accumulation and/or induced mixing at the surface.
Document Type: Research article
Affiliations: 1: Institute for Space and Nuclear Power Studies and Chemical and Nuclear Engineering Department, The University of New Mexico, Albuquerque, New Mexico, USA
Publication date: 2003-10-01
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