Structure-dependent triple junction hardening and intergranular fracture in molybdenum

Authors: Kobayashi, S.¹; Tsurekawa, S.²; Watanabe, T.²

Source: Philosophical Magazine, Volume 86, Numbers 33-35, -35/21 November-11 December 2006 , pp. 5419-5429(11)

Publisher: Taylor and Francis Ltd

Abstract:

The roles of grain boundaries and triple junctions in crack nucleation and propagation in polycrystalline molybdenum are discussed in connection with grain boundary and triple junction hardening. Hardness measurements were made by microindentation tests for molybdenum polycrystalline specimens. The character and the connectivity of grain boundaries at triple junctions were determined by OIM analysis prior to the indentation test. Grain boundary hardening at low-angle and low Σ coincidence boundaries was found to be smaller than at random boundaries. However, the hardening observed at the low-angle and Σ boundaries increased with increasing Brandon's ratio up to almost the same level as that at random boundaries. Triple junction hardening depended on the grain boundary connectivity. The degree of triple junction hardening was smaller at the junctions composed of low-angle and Σ boundaries than at those composed of more random boundaries. The grain boundary connectivity and triple junction character favourable for preventing intergranular fracture is suggested on the basis of the results of structure-dependent grain boundary and triple junction hardening in brittle polycrystalline molybdenum.

Document Type: Research article

DOI: http://dx.doi.org/10.1080/14786430600672711

Affiliations: 1: Department of Mechanical Enigineering, Faculty of Engineering, Ashikaga Institute of Technology, Ashikaga 326-8588, Japan 2: Department of Nanomechanics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan

Publication date: 2006-01-01

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