Effects of Cu and Ag as ternary and quaternary additions on some physical properties of SnSb₇ bearing alloy

Author: Abu Bakr El-Bediwi

Source: Radiation Effects and Defects in Solids, Volume 159, Number 2, February 2004 , pp. 125-132(8)

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Abstract:

The structure, electrical resistivity, and elastic modulus of SnSb₇ and SnSb₇X (X = Cu , Ag, or Cu and Ag) rapidly solidified alloys have been investigated using X-ray diffractometer, double bridge, and dynamic resonance techniques. Copper and silver additions to SnSb result in the formation of a eutectic matrix containing embedded crystals (intermetallic phases) of SnCu, SnAg, and SnSb. The hard crystals SnCu, SnAg, and SnSb increase the overall hardness and wear resistance of SnSb bearing alloys. Addition of copper and silver improves internal friction, electrical conductivity, and elastic modulus values of SnSb rapidly solidified bearing alloys. The internal friction, elastic modulus, and electrical resistivity values are relatively sensitive to the composition of the intermediate phases in the matrix. The SbSb₇Cu₂g₂ has better properties (lowest internal friction, cost, adequate elastic modulus, and electrical resistivity) for bearing alloys as compared to cast iron and bronzes.

Keywords: Structure; Elastic modulus; Internal friction; Electrical resistivity; Bearing

Document Type: Research article

DOI: http://dx.doi.org/10.1080/10420150310001654052

Publication date: 2004-02-01