In thermal models of electronic structures, the heat exchange with surrounding ambient is usually represented by the heat transfer coefficient, which is a strongly temperature dependent quantity. Because in such structures there exist large temperature gradients, the value of this coefficient varies locally significantly. This phenomenon is one of the main sources of errors arising in the dynamic thermal simulation of electronic systems. This article presents a method to estimate the dependence of the heat transfer coefficient on temperature. The proposed method is based on the coupling of Green's function-based direct problem solver and the inverse problem solver using a Landweber-type algorithm. The entire algorithm is validated by the analysis carried out for the thermal model of a real hybrid circuit.
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heat transfer coefficient temperature dependence
Document Type: Research Article
RICAM, Austrian Academy of Sciences, 4040 Linz, Austria,Department of Microelectronics and Computer Science, Technical University of Lodz, 90-924 Lodz, Poland
Industrial Mathematics Institute, Johannes Kepler University, 4040 Linz, Austria
Publication date: 2009-12-01