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RESIDUAL STRESS IN VERY THIN BARIUM STRONTIUM TITANATE FILMS

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Abstract:

Residual stress in thin film barium strontium titanate is thought to be preferentially distributed within the thickness of the film, such that a high degree of residual stress is manifested at the film-substrate interface, and the level of residual stress gradually decreases towards the free surface. To investigate this phenomena, a series of very thin films of barium strontium titanate with both cubic (30-70 Ba-Sr ratio) and tetragonal (80-20 Ba-Sr ratio) lattice structures were fabricated on platinized silicon and magnesium oxide. The thickness of these films was varied from 4-25 nm and the level of residual stress was investigated. The results highlighted within this paper, indicate that the cubic and tetragonal films manifest stress via different mechanisms, and that the substrate affected the magnitude of the residual stress but not the mechanism of stress relief.

Keywords: BST; residual stress; thin film

Document Type: Research Article

DOI: https://doi.org/10.1080/10584580802470843

Affiliations: 1: U.S. Army Research Laboratory, Weapons and Materials Research Directorate, Aberdeen Proving Ground, MD, U.S.A. 2: Dynamic Science, Inc., Aberdeen, MD

Publication date: 2008-01-01

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