Characterization of the breakaway al content in alumina-forming alloys

Authors: Pint, B.A.; Walker, L.R.; Wright, I.G.

Source: Materials at High Temperatures, Volume 21, Number 3, August 2004 , pp. 175-185(11)

Publisher: Science Reviews 2000 Ltd

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Abstract:

Residual Al contents were measured in Fe- and Ni-base alloys in order to improve lifetime prediction models based on the consumption of the Al reservoir. Measurements were made using electron probe microanalysis (EPMA) on both foil (50-125 μm thickness) and plate (0.5-2mm) material. For FeCrAl, NiCrAl and Fe3Al plate specimens, significant Al concentration gradients were measured. An Al gradient is not considered in current reservoir type models. Residual Al contents at the onset of breakaway oxidation were somewhat lower than previously reported for several FeCrAl alloys and significantly higher (≫10at.%) for Fe3Al and Fe-Al alloys. The implications of these results for performance and lifetime predictions are discussed.

Keywords: residual Al contents; alumina-forming alloys

Document Type: Research article

DOI: http://dx.doi.org/10.3184/096034004782749917

Affiliations: 1: Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831-6156, USA

Publication date: 2004-08-15

More about this publication?
  • Materials at High Temperatures serves the needs of those who develop and use materials for high temperature applications. It publishes peer reviewed contributions relating to high temperature applications in the power, chemical, engine, processing and furnace industries.

    The effects of high temperatures on corrosion, fatigue, creep, strength and wear in alloys, intermetallics, ceramics, refractories and composites are covered. Papers dealing with aspects of materials usage including modelling of behaviour and life prediction will be particularly welcome. The journal has a policy of emphasizing practical aspects and authors presenting results from research programmes are encouraged to relate these, if possible, to actual or potential applications.

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