Low-cycle fatigue life prediction for Waspaloy

Authors: Yeom, J.T.; Williams, S.J.; Park, N.K.

Source: Materials at High Temperatures, Volume 19, Number 3, August 2002 , pp. 153-161(9)

Publisher: Science Reviews 2000 Ltd

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Abstract:

Methodologies of correlating and predicting life to failure in low cycle fatigue are investigated for Waspaloy at various temperatures. The viscoplastic material model proposed by Chaboche was initially adopted in order to predict the inelastic behaviour observed in low cycle fatigue. Life predictions under low-cycle fatigue loading conditions for the disc material Waspaloy were investigated with two models, the strain range partitioning method (SRP) and the linear combination of creep and fatigue damage laws. In the SRP rule, decomposition method using a computer modeling for determining the model parameters is proposed. The capabilities of the two models were assessed using strain-controlled LCF test results on Waspaloy.

Keywords: unified vicoplastic material model; life prediction; low cycle fatigue; Waspaloy

Document Type: Research article

DOI: http://dx.doi.org/10.3184/096034002783640404

Affiliations: 1: Korea Institute of Machinery and Materials, 66 Sangnam-Dong, Changwon 641-010, South Korea

Publication date: 2002-08-15

More about this publication?
  • Materials at High Temperatures serves the needs of those who develop and use materials for high temperature applications. It publishes peer reviewed contributions relating to high temperature applications in the power, chemical, engine, processing and furnace industries.

    The effects of high temperatures on corrosion, fatigue, creep, strength and wear in alloys, intermetallics, ceramics, refractories and composites are covered. Papers dealing with aspects of materials usage including modelling of behaviour and life prediction will be particularly welcome. The journal has a policy of emphasizing practical aspects and authors presenting results from research programmes are encouraged to relate these, if possible, to actual or potential applications.

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