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Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review

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Adhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints.
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Keywords: ANALYTICAL AND NUMERICAL STUDIES; BI-ADHESIVE; MODULUS-GRADED ADHESIVE

Document Type: Review Article

Publication date: 01 March 2018

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