Effect of Acetylation on the Mechanical and Thermal Properties of Soy Flour Elastomers
Biobased fillers were utilized as components in soy-elastomer composites. Soy flour is lightweight, low cost, and high strength, which makes it an ideal alternative to petroleum-derived fillers. However, poor interfacial adhesion and low dispersion within the polymer matrix are limiting factors for composite performance. Soy flour chemically pretreated by acetylation was compounded with synthetic rubber elastomers. In general, soy flour (as received) concentration in the composite is proportional to the ultimate strength. However, soy-elastomer composites with acetylated filler performed similar to the neat elastomer. In addition, the pretreated composite's thermal stability increased and exhibited less phase seperation compared to the untreated composites.
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Document Type: Research Article
Publication date: 01 January 2017
This article was made available online on 03 June 2017 as a Fast Track article with title: "Effect of Acetylation on the Mechanical and Thermal Properties of Soy Flour Elastomers".
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- The Journal of Renewable Materials (JRM) publishes high quality peer reviewed original research on macromolecules and additives obtained from renewable/biobased resources. Utilizing a multidisciplinary approach, JRM introduces cutting-edge research on biobased monomers, polymers, additives (both organic and inorganic), their blends and composites. It showcases both fundamental aspects and new applications for renewable materials. The fundamental theories and topics pertain to chemistry of biobased monomers, macromoners and polymers, their structure-property relationship, processing using sustainable methods, characterization (spectroscopic, morphological, thermal, mechanical, and rheological), bio and environmental degradation, and life cycle analysis. Demonstration of use of renewable materials and composites in applications including adhesives, bio and environmentally degradable structures, biomedicine, construction, electrical & electronics, mechanical, mendable and self-healing systems, optics, packaging, recycling, shape-memory, and stimulus responsive systems will be presented.
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