Particleboard Based on Rice Husk: Effect of Binder Content and Processing Conditions
In the development of materials based on renewable resources, the search for lignocellulosic substitutes for wood is one of the biggest challenges that academia and the particleboard and wood industries are facing. In this article, particleboards were processed using rice husk, an agricultural waste, as a substitute for wood. Rice husk without any further treatment was processed into particleboards using phenol-formaldehyde resin as binder. The effect of the processing parameters, pressure and binder content (BC) on the density, water absorption (WA), thickness swelling (TS), modulus of rupture (MOR) and modulus of elasticity (MOE) was analyzed. The performance of the obtained panels was evaluated in comparison with the US Standard ANSI/A208.1. Particleboards with 11% of BC met the minimum requirements of MOR and MOE recommended by the ANSI specifications for commercial use, while particleboards with high BC (14%) also accomplished the requirements for industrial use, finding a resourceful use for this agricultural waste.
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Document Type: Research Article
Publication date: 2017-10-01
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- The Journal of Renewable Materials (JRM) publishes high quality peer reviewed original research on macromolecules and additives obtained from renewable/biobased resources. Utilizing a multidisciplinary approach, JRM introduces cutting-edge research on biobased monomers, polymers, additives (both organic and inorganic), their blends and composites. It showcases both fundamental aspects and new applications for renewable materials. The fundamental theories and topics pertain to chemistry of biobased monomers, macromoners and polymers, their structure-property relationship, processing using sustainable methods, characterization (spectroscopic, morphological, thermal, mechanical, and rheological), bio and environmental degradation, and life cycle analysis. Demonstration of use of renewable materials and composites in applications including adhesives, bio and environmentally degradable structures, biomedicine, construction, electrical & electronics, mechanical, mendable and self-healing systems, optics, packaging, recycling, shape-memory, and stimulus responsive systems will be presented.
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