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Thermal Degradation of Type I Collagen from Bones

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The denaturation processes of collagen in the temperature range between 450 K and 670 K are revealed through studies performed on cow rib bones by means of mechanical spectroscopy, differential scanning calorimetry, thermogravimetry, scanning electron microscopy and infrared spectroscopy. The conformational change of the collagen molecules from a triple helix structure to a random coil was found at around 510 K. It was determined that the transformation is developed through the viscous movement of fibrils with an activation energy of (127 ± 8) kJ/mol. The second stage of massive bulk deterioration of the collagen was found at around 600 K, which leads to the loss of the mechanical integrity of the bulk collagen. In addition, an easy-to-handle viscoelastic procedure for obtaining the activation energy of the denaturation process from mechanical spectroscopy studies was also shown.
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Keywords: ARCHAEOMETRY; BONE REPAIR; THERMAL DENATURATION; TISSUE ENGINEERING; TYPE I COLLAGEN

Document Type: Research Article

Publication date: 2016-08-01

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  • The Journal of Renewable Materials (JRM) publishes high quality peer reviewed original research on macromolecules and additives obtained from renewable/biobased resources. Utilizing a multidisciplinary approach, JRM introduces cutting-edge research on biobased monomers, polymers, additives (both organic and inorganic), their blends and composites. It showcases both fundamental aspects and new applications for renewable materials. The fundamental theories and topics pertain to chemistry of biobased monomers, macromoners and polymers, their structure-property relationship, processing using sustainable methods, characterization (spectroscopic, morphological, thermal, mechanical, and rheological), bio and environmental degradation, and life cycle analysis. Demonstration of use of renewable materials and composites in applications including adhesives, bio and environmentally degradable structures, biomedicine, construction, electrical & electronics, mechanical, mendable and self-healing systems, optics, packaging, recycling, shape-memory, and stimulus responsive systems will be presented.
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