Investigating the Viscoelastic Properties and Mechanical Performance of Wood Modifi ed by Biopolyester Treatments
Oligomer systems based on poly(lactic acid) (PLA), poly(glycolic acid) (PGA), poly(butylene succinate) (PBS) and poly(butylene adipate) (PBA) were impregnated in wood and polymerized in situ to improve the dimensional stability of the treated wood. Dynamic mechanical thermal analysis (DMTA) was used to characterize the impact on the treated wood properties. Cell wall bulking treatments (PLA and PGA oligomers: OLA and OGA) induced softening and plasticization of wood components. Lumen filling treatments (PBS and PBA oligomers: OBS and OBA) led to minor decreases in treated wood stiffness with any softening dependent on the polymer melt temperature. Overall, no oligomer treatment induced any significant wood reinforcement, but the Tg of wood components could be reduced significantly.
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Document Type: Research Article
Publication date: 01 December 2014
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- The Journal of Renewable Materials (JRM) publishes high quality peer reviewed original research on macromolecules and additives obtained from renewable/biobased resources. Utilizing a multidisciplinary approach, JRM introduces cutting-edge research on biobased monomers, polymers, additives (both organic and inorganic), their blends and composites. It showcases both fundamental aspects and new applications for renewable materials. The fundamental theories and topics pertain to chemistry of biobased monomers, macromoners and polymers, their structure-property relationship, processing using sustainable methods, characterization (spectroscopic, morphological, thermal, mechanical, and rheological), bio and environmental degradation, and life cycle analysis. Demonstration of use of renewable materials and composites in applications including adhesives, bio and environmentally degradable structures, biomedicine, construction, electrical & electronics, mechanical, mendable and self-healing systems, optics, packaging, recycling, shape-memory, and stimulus responsive systems will be presented.
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