If you are experiencing problems downloading PDF or HTML fulltext, our helpdesk recommend clearing your browser cache and trying again. If you need help in clearing your cache, please click here . Still need help? Email help@ingentaconnect.com

Corroded Surface Roughness of Copper Analyzed by Fourier Transform Infrared Mapping Microscopy and Optical Profilometric Study

$29.00 plus tax (Refund Policy)

Buy Article:

Abstract:

This study shows the effects of roughness on infrared spectra shapes of thin corrosion products on metallic substrates. The calculated spectra show that the baseline is mainly affected by increasing roughness and that such effects do not shift the position of the absorption bands. The model obtained has been used to extract data of artificial patina on a copper surface. Surface defects of copper substrates can be distinguished on the whole surface, from the morphological and chemical points of view, using optical profilometry and infrared microspectroscopy. An homogeneous layer of cuprite covers the surface except in the linear defects. Fourier transform infrared (FT-IR) analysis indicates that a mixture of atacamite and clinoatacamite is mainly located in these scratchs. The width of these particular areas is in good agreement with profilometric observations.

Keywords: ATACAMITE; CLINOATACAMITE; COPPER; FOURIER TRANSFORM INFRARED; FT-IR MAPPING MICROSCOPY; ROUGHNESS

Document Type: Research Article

DOI: http://dx.doi.org/10.1366/000370204322842904

Affiliations: Institut des materiaux, LASTSM, Université de Rouen, UPRES-EA 1290, 76801 Saint Etienne du Rouvray cedex, France

Publication date: February 1, 2004

More about this publication?
Related content

Tools

Favourites

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more