Analysis of Solders by X-Ray Spectrometry

$29.00 plus tax (Refund Policy)

Buy Article:

Abstract:

The determination of several percent of Au, Ag, and Cu in various Sn/Pb solder compositions used in the manufacture of microelectronic circuits is described. Details of the preparation of standards and x-ray procedure are given. The Au calibration curve can be prepared from any Sn/Pb composition. The Ag and Cu calibration curves must be prepared for each solder composition.

Document Type: Research Article

DOI: http://dx.doi.org/10.1366/000370268774383624

Affiliations: IBM Components Division, East Fishkill Facility, Hopewell Junction, New York 12533

Publication date: March 1, 1968

More about this publication?
Related content

Tools

Favourites

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more