Analysis of Solders by X-Ray Spectrometry

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The determination of several percent of Au, Ag, and Cu in various Sn/Pb solder compositions used in the manufacture of microelectronic circuits is described. Details of the preparation of standards and x-ray procedure are given. The Au calibration curve can be prepared from any Sn/Pb composition. The Ag and Cu calibration curves must be prepared for each solder composition.

Document Type: Research Article


Affiliations: IBM Components Division, East Fishkill Facility, Hopewell Junction, New York 12533

Publication date: March 1, 1968

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