Authors: Zanin, S.J.; Hooser, G.E.

Source: Applied Spectroscopy, Volume 22, Issue 2, Pages 95-123 (March/April 1968) , pp. 105-108(4)

Publisher: Society for Applied Spectroscopy

Abstract:

The determination of several percent of Au, Ag, and Cu in various Sn/Pb solder compositions used in the manufacture of microelectronic circuits is described. Details of the preparation of standards and x-ray procedure are given. The Au calibration curve can be prepared from any Sn/Pb composition. The Ag and Cu calibration curves must be prepared for each solder composition.

Document Type: Research article

DOI: http://dx.doi.org/10.1366/000370268774383624

Affiliations: 1: IBM Components Division, East Fishkill Facility, Hopewell Junction, New York 12533

Publication date: 1968-03-01

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