Soldering & Surface Mount Technology

Temperature cycling with Peltier elements of boards with SMD components and failure evaluation
pp. 53-61(9)
Authors: Šandera, Josef; Nicák, Michal

Reliability analysis of an ACA attached flex-on-board assembly for industrial application
pp. 62-70(9)
Authors: Kiilunen, Janne; Frisk, Laura

Statistical analysis of stencil technology for wafer-level bumping
pp. 71-78(8)
Authors: Kay, Robert W.; Cummins, Gerard; Krebs, Thomas; Lathrop, Richard; Abraham, Eitan; Desmulliez, Marc

Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution
pp. 79-86(8)
Authors: Lee, Liu Mei; Nazeri, Muhammad Firdaus Mohd; Haliman, Habsah; Mohamad, Ahmad Azmin

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow
pp. 87-95(9)
Authors: Mittal, J.; Lin, K.L.