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Publisher: Emerald Group Publishing Limited

Volume 26, Number 2, 2014

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Statistical analysis of stencil technology for wafer-level bumping
pp. 71-78(8)
Authors: Kay, Robert W.; Cummins, Gerard; Krebs, Thomas; Lathrop, Richard; Abraham, Eitan; Desmulliez, Marc

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Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution
pp. 79-86(8)
Authors: Lee, Liu Mei; Nazeri, Muhammad Firdaus Mohd; Haliman, Habsah; Mohamad, Ahmad Azmin

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