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Publisher: Emerald Group Publishing Limited

Volume 26, Number 1, 2014

Voids investigation in solder joints performed with vapour phase soldering (VPS)
pp. 8-11(4)
Authors: Synkiewicz, Beata Kinga; Skwarek, Agata; Witek, Krzysztof

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Characterization of nano-enhanced interconnect materials for fine pitch assembly
pp. 12-17(6)
Authors: Zhang, Yan; Sitek, Janusz; Fan, Jing-yu; Ma, Shiwei; Koscielski, Marek; Ye, Lilei; Liu, Johan

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Electrodeposition of thin metallic layer for solar cell electrodes
pp. 18-21(4)
Authors: Drabczyk, Kazimierz; Socha, Robert; Panek, Piotr; Mordarski, Grzegorz

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Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomena
pp. 22-26(5)
Authors: Jankowski, Krystian; Wymyslowski, Artur; Chicot, Didier

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Reliability investigations for high temperature interconnects
pp. 27-36(10)
Authors: Dudek, Rainer; Sommer, Peter; Fix, Andreas; Trodler, Joerg; Rzepka, Sven; Michel, Bernd

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