Publisher: Emerald Group Publishing Limited

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Volume 25, Number 4, 2013

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SAC solder paste with carbon nanotubes. Part II: carbon nanotubes' effect on solder joints' mechanical properties and microstructure
pp. 195-208(14)
Authors: Bukat, Krystyna; Sitek, Janusz; Koscielski, Marek; Niedzwiedz, Wojciech; Mlozniak, Anna; Jakubowska, Malgorzata

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Cu filling of TSV using various current forms for three-dimensional packaging application
pp. 209-217(9)
Authors: Roh, Myong-Hoon; Lee, Jun-Hyeong; Kim, Wonjoong; Jung, Jea Pil

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A study into the re-processing of pure tin termination finishes into tin-lead
pp. 218-228(11)
Authors: Turner, Ian C.; Dunn, Barrie D.; Barnes, Cathy

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A review: influence of nano particles reinforced on solder alloy
pp. 229-241(13)
Authors: Noor, Ervina Efzan Mhd; Singh, Amares; Chuan, Yap Tze

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Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material
pp. 242-250(9)
Authors: Chen, Si; Jiang, Di; ZandeĀ“n, Carl; Hu, Zhili; Fu, Yifeng; Zhang, Yan; Ye, Lilei; Liu, Johan

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