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Publisher: Emerald Group Publishing Limited

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Volume 25, Number 3, 2013

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Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder
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Authors: Ye, Huan; Xue, Songbai; Chen, Cheng; Li, Yang

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An alternative JEDEC test board design and analysis
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The behaviour of solder pastes in stencil printing with electropolishing process
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Comparison study of SAC405 and SAC405+0.1%Al lead free solders
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