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Publisher: Emerald Group Publishing Limited

Volume 25, Number 3, 2013

Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder
pp. 139-144(6)
Authors: Ye, Huan; Xue, Songbai; Chen, Cheng; Li, Yang

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An alternative JEDEC test board design and analysis
pp. 155-163(9)
Authors: Liu, Fang; Meng, Guang; Zhao, Junfeng

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The behaviour of solder pastes in stencil printing with electropolishing process
pp. 164-174(11)
Authors: Lee, Yong-Won; Kim, Keun-Soo; Suganuma, Katsuaki

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Comparison study of SAC405 and SAC405+0.1%Al lead free solders
pp. 175-183(9)
Authors: Kolen├ík, Roman; Augustin, Robert; Martinkovic, Maroš; Chachula, Michal

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