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Publisher: Emerald Group Publishing Limited

Volume 25, Number 2, 2013

Characteristics and properties of Bi-11Ag solder
pp. 68-75(8)
Authors: Kolenák, Roman; Chachula, Michal

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Electrodeposition of lead-free solder alloys
pp. 76-90(15)
Authors: Goh, Yingxin; Haseeb, A.S.M.A.; Sabri, Mohd Faizul Mohd

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Characterization of vapour phase soldering process zone with pressure measurements
pp. 99-106(8)
Authors: Géczy, Attila; Illés, Balázs; Péter, Zsolt; Illyefalvi-Vitéz, Zsolt

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Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste
pp. 107-116(10)
Authors: Mei, Yunhui; Chen, Gang; Li, Xin; Lu, Guo-Quan; Chen, Xu

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