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Publisher: Emerald Group Publishing Limited

Volume 25, Number 1, 2013

The effect of micro via-in pad design on surface-mount assembly defects: part II ‐ voiding and spattering
pp. 4-14(11)
Authors: Lee, Yong-Won; Kim, Keun-Soo; Suganuma, Katsuaki

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Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow
pp. 15-23(9)
Authors: Lee, Liu Mei; Haliman, Habsah; Mohamad, Ahmad Azmin

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Solder joint degradation and detection using RF impedance analysis
pp. 25-30(6)
Authors: Bin, Yao; Yudong, Lu; Ming, Wan

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Solidification and reliability of lead-free solder interconnection
pp. 31-38(8)
Authors: Yu, Hao; Shangguan, Dongkai

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Surface oxide analysis of lead-free solder particles
pp. 39-44(6)
Authors: Luo, Xin; Du, Wenhui; Lu, Xiuzhen; Yamaguchi, Toshikazu; Jackson, Gavin; Ye, Li lei; Liu, Johan

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Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface material
pp. 45-50(6)
Authors: Rong, Hao; Wang, Baoming; Lin, Wei-Qing; Sun, Lichao; Zheng, Jin-Cheng; Lu, Miao

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