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Publisher: Emerald Group Publishing Limited

Volume 24, Number 4, 2012

Surface finish effect on reliability of SAC 305 soldered chip resistors
pp. 240-248(9)
Authors: Collins, Maurice N.; Punch, Jeff; Coyle, Richard

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Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints
pp. 249-256(8)
Authors: Bi, Wenzhen; Ju, Guokui; Lin, Fei; Xie, Shifang; Wei, Xicheng

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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy
pp. 257-266(10)
Authors: Shnawah, Dhafer Abdul Ameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Bin Mohd; Badruddin, Irfan Anjum; Che, Fa Xing

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SAC 305 solder paste with carbon nanotubes ‐ part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties
pp. 267-279(13)
Authors: Bukat, K.; Sitek, J.; Koscielski, M.; Jakubowska, M.; Sloma, M.; Mlozniak, A.; Niedzwiedz, W.

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Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder
pp. 280-286(7)
Authors: Xue, Peng; Xue, Songbai; Shen, Yifu; Xiao, Zhengxiang; Zhu, Hong; Long, Weimin; Yu, Xinquan

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Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer-level underfill film
pp. 287-293(7)
Authors: Yang, Tsung-Fu; Kao, Kuo-Shu; Cheng, Ren-Chin; Chang, Jing-Yao; Zhan, Chau-Jie

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