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Publisher: Emerald Group Publishing Limited

Volume 24, Number 3, 2012

Three-dimensional thermal investigations at board level in a reflow oven using thermal-coupling method
pp. 167-182(16)
Authors: Lau, Chun-Sean; Abdullah, M.Z.; Ani, F. Che

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Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N2 or exposed to air atmosphere
pp. 191-196(6)
Authors: Liu, Wei; Tian, Yanhong; Yang, Lei; Wang, Chunqing; Sun, Lining

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The effect of micro via-in pad designs on surface-mount assembly defects: part I ‐ tombstoning
pp. 197-205(9)
Authors: Lee, Yong-Won; Kim, Keun-Soo; Suganuma, Katsuaki

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Mechanical durability of RFID chip joints assembled on flexible substrates
pp. 206-215(10)
Authors: Janeczek, Kamil; Serzysko, Tomasz; Jakubowska, Malgorzata; Koziol, Grazyna; Mlozniak, Anna

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