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Publisher: Emerald Group Publishing Limited

Volume 24, Number 1, 2012

Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders
pp. 4-11(8)
Authors: Bukat, Krystyna; Sitek, Janusz; Koscielski, Marek; Moser, Zbigniew; Gasior, Wladyslaw; Pstrus, Janusz

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A new conformal coating adhesion test for electronic assemblies
pp. 12-21(10)
Authors: Zou, Ling; Hunt, Chris

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A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints
pp. 22-29(8)
Authors: Liu, De-Shin; Hsu, Chang-Lin; Kuo, Chia-Yuan; Huang, Ya-Ling; Lin, Kwang-Lung; Shen, Geng-Shin

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Through lifetime monitoring of solder joints using acoustic micro imaging
pp. 30-37(8)
Authors: Yang, Ryan S.H.; Braden, Derek R.; Zhang, Guang-Ming; Harvey, David M.

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A review of stencil printing for microelectronic packaging
pp. 38-50(13)
Authors: Kay, Robert; Desmulliez, Marc

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