Soldering & Surface Mount Technology

The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction
pp. 211-223(13)
Authors: Huang, Chien-Yi; Lin, Yueh-Hsun; Ying, Kuo-Ching; Ku, Chen-Liang

Wettability and shear strength of active Sn2Ti solder on Al₂O₃ ceramics
pp. 224-228(5)
Authors: Kolenák, Roman; Chachula, Michal; Šebo, Pavol; Kolenáková, Monika

Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand-off heights
pp. 229-234(6)
Authors: Wang, Bo; Wu, Fengshun; Wu, Yiping; Mo, Liping; Xia, Weisheng

Process characterization and reliability for the assembly of 01005 chip components
pp. 235-243(9)
Authors: Lee, Yong-Won; Kim, Keun-Soo; Suganuma, Katsuaki

Systematic mechanical design approach for a flexible printed circuit board assemblies (PCBA) rework cell: part I ‐ generic mechanical design procedure
pp. 244-256(13)
Authors: Geren, Necdet; Sarigül, Çagdas; Bayramoglu, Melih