Skip to main content

Publisher: Emerald Group Publishing Limited

Volume 23, Number 4, 2011

The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction
pp. 211-223(13)
Authors: Huang, Chien-Yi; Lin, Yueh-Hsun; Ying, Kuo-Ching; Ku, Chen-Liang

Favourites:
ADD

Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics
pp. 224-228(5)
Authors: Kolenák, Roman; Chachula, Michal; Šebo, Pavol; Kolenáková, Monika

Favourites:
ADD

Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand-off heights
pp. 229-234(6)
Authors: Wang, Bo; Wu, Fengshun; Wu, Yiping; Mo, Liping; Xia, Weisheng

Favourites:
ADD

Process characterization and reliability for the assembly of 01005 chip components
pp. 235-243(9)
Authors: Lee, Yong-Won; Kim, Keun-Soo; Suganuma, Katsuaki

Favourites:
ADD

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more