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Publisher: Emerald Group Publishing Limited

Volume 23, Number 3, 2011

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Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper
pp. 150-160(11)
Authors: Bukat, K.; Koscielski, M.; Sitek, J.; Jakubowska, M.; Mlozniak, A.

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Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
pp. 161-167(7)
Authors: Li, Jue; Xu, Hongbo; Hokka, Jussi; Mattila, Toni T.; Chen, Hongtao; Paulasto-Kröckel, Mervi

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Modifications of the 85/85 test and the temperature cycling test for tantalum capacitors
pp. 168-176(9)
Authors: Virkki, Johanna; Sydänheimo, Lauri; Raumonen, Pasi

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Tensile strength of fine pitch QFP lead-free soldered joints with diode laser soldering
pp. 177-183(7)
Authors: Xue, Peng; Xue, Song-bai; Zhang, Liang; Shen, Yi-fu; Gao, Li-li; Yu, Sheng-lin; Zhu, Hong; Han, Zongjie; Chen, Yan

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Occurrence of tin pest on the surface of tin-rich lead-free alloys
pp. 184-190(7)
Authors: Skwarek, Agata; Sroda, Marcin; Pluska, Mariusz; Czerwinski, Andrzej; Ratajczak, Jacek; Witek, Krzysztof

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