Publisher: Emerald Group Publishing Limited

Related content
Volume 23, Number 2, 2011

< previous issue | all issues | next issue >

Favourites:Add to Favourites

Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder
pp. 68-74(7)
Authors: Nadia, Aemi; Haseeb, A.S.M.A.

Favourites:Add to Favourites
Favourites:Add to Favourites

Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA
pp. 85-90(6)
Authors: Lee, Kong Hui; Jukna, Rob; Altpeter, Jim; Doss, Kantesh

Favourites:Add to Favourites

Stability investigations of automatic X-ray inspection systems
pp. 91-103(13)
Authors: Latos, István; Janóczki, Mihály

Favourites:Add to Favourites

Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules
pp. 104-114(11)
Authors: Nousiainen, O.; Salmela, O.; Putaala, J.; Kangasvieri, T.

Favourites:Add to Favourites

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more