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Publisher: Emerald Group Publishing Limited

Volume 23, Number 2, 2011

Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder
pp. 68-74(7)
Authors: Nadia, Aemi; Haseeb, A.S.M.A.

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Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA
pp. 85-90(6)
Authors: Lee, Kong Hui; Jukna, Rob; Altpeter, Jim; Doss, Kantesh

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Stability investigations of automatic X-ray inspection systems
pp. 91-103(13)
Authors: Latos, István; Janóczki, Mihály

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Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules
pp. 104-114(11)
Authors: Nousiainen, O.; Salmela, O.; Putaala, J.; Kangasvieri, T.

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