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Publisher: Emerald Group Publishing Limited

Volume 23, Number 1, 2011

Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints
pp. 4-9(6)
Authors: Zhang, Liang; Xue, Song-bai; Gao, Li-li; Sheng, Zhong; Dai, Wei; Ji, Feng; Ye, Huan; Chen, Yan; Yu, Sheng-lin

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Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
pp. 10-14(5)
Authors: Tay, S.L.; Haseeb, A.S.M.A.; Johan, Mohd Rafie

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Development of a lead-free solder: Sn-4.0Bi-3.7Ag-0.9Zn
pp. 15-21(7)
Authors: Wang, Xun; Liu, Yongchang; Yu, Liming; Dong, Zhizhong; Gao, Zhiming

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Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders
pp. 22-29(8)
Authors: Moser, Z.; Fima, P.; Bukat, K.; Sitek, J.; Pstrus, J.; Gasior, W.; Koscielski, M.; Gancarz, T.

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies
pp. 30-39(10)
Authors: Nousiainen, O.; Kangasvieri, T.; Rautioaho, R.; Vähäkangas, J.

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A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints
pp. 40-46(7)
Authors: Wang, Bo; Wu, Fengshun; Wu, Yiping; An, Bing; Liu, Hui; Zou, Jian

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