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Publisher: Emerald Group Publishing Limited

Volume 22, Number 4, 2010

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Effects of multiple BGA rework on strength of solder joints
pp. 20-30(11)
Authors: Dariavach, N.; Liang, J.; Barr, G.; Shangguan, D.

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An experimental and numerical investigation into the effects of the chip-on-film (COF) processing parameters on the Au-Sn bonding temperature
pp. 31-41(11)
Authors: Liu, De-Shin; Yeh, Shu-Shen; Kao, Chun-Teh; Huang, Pay-Yau; Tsai, Chia-I; Liu, An-Hong; Ho, Shu-Ching

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Creep properties of Sn-0.7Cu composite solder joints reinforced with nano-sized Ag particles
pp. 50-56(7)
Authors: Tai, Feng; Guo, Fu; Liu, Jianping; Xia, Zhidong; Shi, Yaowu; Lei, Yongping; Li, Xiaoyan

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Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments
pp. 57-64(8)
Authors: Zeng, Guang; Xue, Songbai; Zhang, Liang; Sheng, Zhong; Gao, Lili

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