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Publisher: Emerald Group Publishing Limited

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Volume 22, Number 3, 2010

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Effect of Bi on the microstructure and tensile behavior of Sn-3.7Ag solders
pp. 4-9(6)
Authors: He, M.; Leon, N. De; Acoff, V.L.

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Investigation of Sn-Zn-Bi solders ‐ Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders
pp. 10-16(7)
Authors: Bukat, K.; Moser, Z.; Sitek, J.; Gasior, W.; Koscielski, M.; Pstrus, J.

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Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC/PWB assemblies
pp. 22-35(14)
Authors: Nousiainen, O.; Kangasvieri, T.; Kautio, K.; Rautioaho, R.; Vähäkangas, J.

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Experimental investigation on the failure of lead-free solder joints under drop impact
pp. 36-41(6)
Authors: Liu, Fang; Meng, Guang; Zhao, Mei

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Thermal cycling of flip chips on FR-4 and PI substrates with parylene C coating
pp. 42-48(7)
Authors: Kokko, Kati; Frisk, Laura; Heino, Pekka

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