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Publisher: Emerald Group Publishing Limited

Volume 22, Number 2, 2010

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Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
pp. 13-20(8)
Authors: Xu, R.L.; Liu, Y.C.; Wei, C.; Yu, L.M.

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Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies
pp. 21-29(9)
Authors: Nousiainen, Olli; Urhonen, Timo; Kangasvieri, Tero; Rautioaho, Risto; Vähäkangas, Jouko

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Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
pp. 30-36(7)
Authors: Zhang, Liang; Xue, Song-bai; Gao, Li-li; Chen, Yan; Yu, Sheng-lin; Sheng, Zhong; Zeng, Guang

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Thermal fatigue behaviour of Al2O3-DBC substrates under high temperature cyclic loading
pp. 43-48(6)
Authors: Dong, Guangcheng; Chen, Xu; Zhang, Xinjian; Ngo, Khai D.T.; Lu, Guo-Quan

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