Publisher: Emerald Group Publishing Limited
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Activities during melting and reflowing behaviour of solders
Mittal, J.; Lin, K.L.
Effect of stand-off height on the microstructure and mechanical behaviour of solder joints
Wang, Bo; Wu, Fengshun; Wu, Yiping; Liu, Hui; Zhou, Longzao; Fang, Yuebo
Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux
Zerrer, Patrick; Fix, Andreas; Hutter, Matthias; Reichl, Herbert
X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)
Janóczki, Mihály; Jakab, László
Moisture effects on adhesion of non-conductive adhesive attachments
Saarinen, Kirsi; Heino, Pekka
An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies
Dou, Guangbin; Whalley, David C.; Liu, Changqing; Chan, Y.C.
Tin pest in lead-containing solders