Publisher: Emerald Group Publishing Limited

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Volume 22, Number 1, 2010

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Activities during melting and reflowing behaviour of solders
pp. 4-10(7)
Authors: Mittal, J.; Lin, K.L.

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Effect of stand-off height on the microstructure and mechanical behaviour of solder joints
pp. 11-18(8)
Authors: Wang, Bo; Wu, Fengshun; Wu, Yiping; Liu, Hui; Zhou, Longzao; Fang, Yuebo

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Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux
pp. 19-25(7)
Authors: Zerrer, Patrick; Fix, Andreas; Hutter, Matthias; Reichl, Herbert

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X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)
pp. 26-40(15)
Authors: Janóczki, Mihály; Jakab, László

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Moisture effects on adhesion of non-conductive adhesive attachments
pp. 41-46(6)
Authors: Saarinen, Kirsi; Heino, Pekka

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An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies
pp. 47-55(9)
Authors: Dou, Guangbin; Whalley, David C.; Liu, Changqing; Chan, Y.C.

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Tin pest in lead-containing solders
pp. 56-57(2)
Author: Plumbridge, W.J.

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