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Publisher: Emerald Group Publishing Limited
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Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective
Kokko, Kati; Harjunpää, Hanna; Haltia, Anna-Maija; Heino, Pekka; Kellomäki, Minna
Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints
Wickham, Martin; Zou, Ling; Hunt, Christopher
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
Yeh, T.K.; Lin, K.L.; Salam, B.
On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters
Maio, D. Di; Hunt, C.P.
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints
Pan, Jianbiao; Chou, Tzu-Chien; Bath, Jasbir; Willie, Dennis; Toleno, Brian J.
Reflow profile optimization of µBGA solder joints considering reflow temperature and time coupling
Bo, Tao; Zhouping, Yin; Han, Ding; Yiping, Wu
Local melt process of solder bumping by induction heating reflow
Xu, Hongbo; Li, Mingyu; Fu, Yonggao; Wang, Ling; Kim, Jongmyung