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Publisher: Emerald Group Publishing Limited

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Volume 21, Number 4, 2009

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Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective
pp. 4-11(8)
Authors: Kokko, Kati; Harjunpää, Hanna; Haltia, Anna-Maija; Heino, Pekka; Kellomäki, Minna

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Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
pp. 19-23(5)
Authors: Yeh, T.K.; Lin, K.L.; Salam, B.

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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints
pp. 32-37(6)
Authors: Pan, Jianbiao; Chou, Tzu-Chien; Bath, Jasbir; Willie, Dennis; Toleno, Brian J.

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Reflow profile optimization of µBGA solder joints considering reflow temperature and time coupling
pp. 38-44(7)
Authors: Bo, Tao; Zhouping, Yin; Han, Ding; Yiping, Wu

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Local melt process of solder bumping by induction heating reflow
pp. 45-54(10)
Authors: Xu, Hongbo; Li, Mingyu; Fu, Yonggao; Wang, Ling; Kim, Jongmyung

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