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Publisher: Emerald Group Publishing Limited

Volume 21, Number 3, 2009

Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints
pp. 4-9(6)
Authors: Lai, Yi-Shao; Kao, C.R.; Chang, Hsiao-Chuan; Kao, Chin-Li

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Edge tail length effect on reliability of DBC substrates under thermal cycling
pp. 10-15(6)
Authors: Dong, Guangcheng; Lei, Guangyin (Thomas); Chen, Xu; Ngo, Khai; Lu, Guo-Quan

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Composite coating structure in an implantable electronic device
pp. 24-29(6)
Authors: Kokko, Kati; Harjunpää, Hanna; Heino, Pekka; Kellomäki, Minna

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Reliability analysis of a novel fan-out type WLP
pp. 30-38(9)
Authors: Yew, Ming-Chih; Tsai, Mars; Hu, Dyi-Chung; Yang, Wen-Kun; Chiang, Kuo-Ning

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Six sigma analysis of SMD feeding parameters and board assembly quality
pp. 39-46(8)
Authors: Kytösaho, Pekka; Liukkonen, Timo

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