Publisher: Emerald Group Publishing Limited

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Volume 21, Number 2, 2009

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Properties of two new medium temperature solders
pp. 4-8(5)
Authors: Li, Chunyuan; Wang, Xitao; Yuan, Wenxia

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Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
pp. 9-13(5)
Authors: Zou, C.D.; Gao, Y.L.; Yang, B.; Zhai, Q.J.; Andersson, C.; Liu, J.

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The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields
pp. 14-18(5)
Authors: Cheng, Cong-qian; Zhao, Jie; Xu, Yang; Xu, Fu-Min; Huang, Ming-liang

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Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)
pp. 24-27(4)
Authors: Norén, M.; Brunner, S.; Hoffmann, C.; Salz, W.; Aichholzer, K.

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Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
pp. 28-38(11)
Authors: Andersson, C.; Vandevelde, B.; Noritake, C.; Sun, P.; Tegehall, P.E.; Andersson, D.R.; Wetter, G.; Liu, J.

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A study of thermo-mechanical reliability of lead-free PTH solder joints
pp. 39-47(9)
Authors: Nguyen, Jennifer; Geiger, David; Rooney, Dan; Shangguan, Dongkai

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Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint
pp. 48-54(7)
Authors: Chen, S.; Sun, P.; Wei, X.C.; Cheng, Z.N.; Liu, J.

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