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Publisher: Emerald Group Publishing Limited

Volume 21, Number 1, 2009

Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer
pp. 4-10(7)
Authors: Kim, Kyoo-Seok; Jung, Jae-Pil; Zhou, Y. Norman

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Geometry control of solder interconnects via induction heating
pp. 25-30(6)
Authors: Xu, Hongbo; Li, Mingyu; Fu, Yonggao; Wang, Ling; Kim, Jongmyung

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Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis
pp. 31-41(11)
Authors: Lee, Chang-Chun; Chang, Kuo-Chin; Yang, Ya-Wen

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