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Publisher: Emerald Group Publishing Limited

Volume 20, Number 4, 2008

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
pp. 3-8(6)
Authors: Reid, M.; Punch, J.; Collins, M.; Ryan, C.

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Thermal profiling: a reflow process based on the heating factor
pp. 20-27(8)
Authors: Gao, Jin Gang; Wu, Yi Ping; Ding, Han; Wan, Nian Hong

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Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additives
pp. 28-36(9)
Authors: Miyake, Toshihiro; Ishida, Masaru; Inagaki, Satoshi

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